Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
Assembly and Rework of Lead Free Package on Package Technology SMTnet Express March 15, 2012, Subscribers: 25003, Members: Companies: 8826, Users: 32832 Assembly and Rework of Lead Free Package on Package Technology by: Raymond G. Clark, Joseph D
Imagineering, Inc. | https://www.pcbnet.com/blog/a-guide-to-pcb-inspection-methods/
. A second inspection occurs after PCB assembly components have been attached to the board. The IPC has set guidelines for what constitutes an acceptable board
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/quotes.cfm
sticky technical questions after relationships were built at SMTAI. Donald Banks St. Jude Medical SMTAI International is my number one conference for packaging, assembly and all related topics. It's the best place to learn and network with colleagues from
