Electronics Forum: what is solder ball collapse (46)

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Solder ball crack

Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef

First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [

Industry News: what is solder ball collapse (2)

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

What is SMT and where to by SMT spare parts

Industry News | 2017-08-17 06:55:03.0

what is SMT and where to by SMT spare parts

SMTPLAZA CO.,LTD

Videos: what is solder ball collapse (1)

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

Express Newsletter: what is solder ball collapse (1053)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: what is solder ball collapse (310)

How to Prevent a Solder Ball Defect | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/

. Being as common as it is, manufacturers have come to recognize many of the underlying causes that cause solder ball defects. In this blog, we outline everything you need to know about solder balls, what you can do to avoid them, and potential steps for their removal

Imagineering, Inc.

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Atta

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476

Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member

Surface Mount Technology Association (SMTA)


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