Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Tue Sep 25 15:54:55 EDT 2012 | davef
The more that I chew the idea of outgassing through the pad theory, the less I like it. Why would something, water???, choose to outgass through the pad when moving through the solder mask would be a path of much less resistance? And why wouldn't the
Industry News | 2014-08-12 13:50:53.0
Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
interface and this is a defective condition. The reasoning of why this may be happening on only a few pads of a particular component is most likely due to the heat sinking characteristics of the pad/land area
Surface Mount Technology Association (SMTA) | https://www.smta.org/icehet/workshops.cfm
: QFN Package Background IPC-7093 Standard Pad Design Impacts/Influences QFN Thermal Pad Voiding Manufacturing Implementation - Stenciling - Reflow - Cleaning Solder Joint Reliability
