Industry Directory | Manufacturer
Wewon Environmental Chambers Co., Ltd. as a manufacturer and supply environmental test chambers , climatic chambers , xenon test chambers, walk in chambers … for abroad partners many years !
New Equipment | Assembly Services
A commonly used device requiring a trigger transformer are strobe lights. Strobe lights consist of a tube containing an inert gas, such as xenon. Capacitors inside the light are charged up to a relatively high voltage, roughly 300 Volts for small str
Flexible light guides permit strongly localised irradiation. Quick curing of selective sticking and controlling of polymerisation processes is possible using such UV-plants. Different versions of our UV-light-source for high intensive UV irradiation
Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Used SMT Equipment | AOI / Automated Optical Inspection
(2) Orbotech Automated Optical Inspections Machines For Sale Machine were just taken out of Military OEM facility in good working condition Both machines are being sold together at discounted price See attached pictures and information below
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Orbotech VT 9300 Vintage : SEP 2004 *With Calibration Card *Boards Inspected: Post-solder SMT, through-hole and mixed technologies *Number of CCD Cameras: 13 Cameras *Fault Coverage: Component placement accuracy in X, Y and Q,
Industry News | 2012-02-07 00:51:20.0
A key enabling technology that is making a significant impact in consumer, commercial, medical and specialty electronics markets, printed electronics is coming of age at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. IPC APEX EXPO will feature a dedicated printed electronics area on the show floor, a printed electronics track in the technical conference, and historic standards development meetings where the first-ever industry requirements for the manufacture and assembly of printed electronics will be discussed and developed.
Industry News | 2007-12-13 20:35:00.0
WALTHAM, Mass., Dec 12, 2007, PerkinElmer, Inc. (NYSE: PKI), a global technology leader in Health Sciences and Photonics, today announced it has received additional production orders for mobile phone flash assemblies incorporating its Xenon-based flash technology.
Parts & Supplies | Pick and Place/Feeders
Panasonic NPM-W2 scanner N610101135AA scanner DS4308 2D scanner DS6878 USB Cable for 1900 GSR Barcode Scanner CBL-500-300-S00 Vuguest 3310g Scanner 3310g Barcode Scanner DS457-HD20009 Scanner 1900 GSR scanner CS3290-2D+ Barco
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Technical Library | 2021-11-03 16:52:47.0
This paper proposes the integration of pulsed photonic sintering into multi-material additive manufacturing processes in order to produce multifunctional components that would be nearly impossible to produce any other way. Pulsed photonic curing uses high power Xenon flash lamps to thermally fuse printed nanomaterials such as conductive metal inks. To determine the feasibility of the proposed integration, three different polymer additive manufacturing materials were exposed to typical flash curing conditions using a Novacentrix Pulseforge 3300 system. FTIR analysis revealed virtually no change in the polymer substrates, thus indicating that the curing energy did not damage the polymer. Next, copper traces were printed on the same substrate, dried, and photonically cured to establish the feasibility of thermally fusing copper metal on the polymer additive manufacturing substrates. Although drying defects were observed, electrical resistivity values ranging from 0.081 to 0.103 Ω/sq. indicated that high temperature and easily oxidized metals can be successfully printed and cured on several commonly used polymer additive manufacturing materials. These results indicate that pulsed photonic curing holds tremendous promise as an enabling technology for next generation multimaterial additive manufacturing processes.
