Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer
A leading supplier of manual vacuum handling solutions to the worlds high technology firms.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Tue Aug 17 09:43:59 EDT 2021 | lay1014
Application of vacuum technology VACUUM FURNACE Metallurgical industry: The vacuum technology used in the metallurgical industry includes molten steel vacuum processing, vacuum melting, vacuum induction melting, induction shell melting, vacuum arc re
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Used SMT Equipment | Screen Printers
DEK Horizon 03iX SMT Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type Hawkeye 750 or Hawkeye 1700 (optional) 198040 198043 hawkeye Board foil clamp siz
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
Parts & Supplies | Pick and Place/Feeders
SAMSUNG SMT MARGINAL RAY CP40LV VACUUM GENERATOR Any more requirement ,pls send me mail to :sheryl@ksunsmt.com
Parts & Supplies | Pick and Place/Feeders
SAMSUNG 34B-LOO-GDFA-1KT /SM471、482、481 VACUUM SOLENOID VALVE HEAD Any more requirement ,pls send me mail to :sheryl@ksunsmt.com
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Events Calendar | Thu Oct 30 00:00:00 EDT 2025 - Thu Oct 30 00:00:00 EDT 2025 | ,
Designing for Space: Understanding the IPC-6012 Space Addendum
Career Center | BIDDEFORD, Maine USA | Engineering,Maintenance
Searching for a Facilities Engineer with a strong Mechanical and/or Industrial background. Experience facilitating the design of machinery and equipment in a fast paced environment required. Strong knowledge of facilities and building maintenance a
Career Center | Los Angeles, Dallas, Atlanta, Texas, Georgia USA | Sales/Marketing
Client company seeks sales managers (3 Locations)who will develop a sustainable and profitable level of revenue growth for an exciting organization who has the ability to completely control the supply chain for its clients in the electronic OEM marke
Career Center | Buford, Georgia USA | Technical Support
Over 9 years of Assembleon Electronic Manufacturing Equipment training and support. Primary machine experience: FCM I, II, and Multi-Flex, ACM Micro and AX. Dedicated CTT+ Certified Training Professional. Experienced in Instructor-led training an
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
SMTnet Express, June 7, 2018, Subscribers: 31,097, Companies: 10,956, Users: 24,801 Potting Under Vacuum or Atmosphere? Scheugenpflug; Scheugenpflug Inc. Potting under vacuum or atmospheric conditions? This question about the correct procedure
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) OPERATIONAL REQUIREMENTS After engineering thermal profiling
ASCEN Technology | https://www.ascen.ltd/Blog/machine/online_loader_unloader/list_39_2.html
. ASCEN PCB automatic loader is used for providing pcb to following machine according to producing requirement in the starting process of on-line smt manufacturing line, SMEMA pro
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_equipment_board_routers_ipte.html
of Routing and/ or sawing Vacuum Tooling 208 VAC - 50/60 HZ - 5 kva - 16A - 6 Bar CE Marked PC - Monitor - Accessories Operator Friendly - Easy to Use Original Price: $250,000 + Location
