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ICEPT 2017, The 18th International Conference on Electronic Packaging Technology

Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China

ICEPT 2017, The 18th International Conference on Electronic Packaging Technology

Chinese Institute of Electronics (CIE)

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Electronics Equipment Consignment

High Precision Fluid Dispensers
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

High Throughput Reflow Oven
Fluid Dispensing, Staking, TIM, Solder Paste

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

Original SMT Feeders and spares for Panasonic, Fuji , Yamaha, Juki , Samsung