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IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: Networking in a Virtual World

Events Calendar | Thu May 06 00:00:00 EDT 2021 - Thu May 06 00:00:00 EDT 2021 | ,

Webinar: Networking in a Virtual World

Surface Mount Technology Association (SMTA)

Assembly Technology Expo

Events Calendar | Wed Jun 21 00:00:00 EDT 2017 - Sat Jun 24 00:00:00 EDT 2017 | Bangkok, Thailand

Assembly Technology Expo

Reed Exhibitions

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