Events Calendar: solder missing in reflow (Page 1 of 1)

SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data

Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA

SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

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