New SMT Equipment: 0.5 pitch csp (Page 1 of 7)

Hanwha HM520 Pick and Place Machine

Hanwha HM520 Pick and Place Machine

New Equipment | Pick & Place

Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm​ weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch

Qersa Technology Co.,ltd

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

M99 BGS/QFP MOUNTER

New Equipment |  

.for QFP/BGA/CSP .Medium speed with 2 head .Full vision for fine pitch and ball miss check Competitive price

Mirle Automation Corporation

HITACHI PXH-1 Screen Printer

HITACHI PXH-1 Screen Printer

New Equipment | Printing

With its compact size, high-speed and high precision, the machine achieves a high level of cost-performance. PXH-1 is a high-performance screen printer that enables high speed and high accuracy printing within a compact frame. The PXH-1 printer is

Hitachi High Technologies America, Inc.

Sniper Flo-master

Sniper Flo-master

New Equipment |  

The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices

A.P.E. South

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

Electronic PCB assembly

New Equipment |  

Our manufacturing capabilities allow us to support all aspects of the electronics manufacturing process. Our production processes include: High speed continuous flow SMT lines. High Mix SMT and PTH. Automated PTH assembly. Fine Pitch, BGA, CSP, C

Apsco International

Electronics Manufacturing Services

New Equipment |  

Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt

SELDS, Inc.

LED Board

LED Board

New Equipment |  

Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph; Hand build ;

Shenzhen BQC Electronic CO.,Ltd.

FPCA

FPCA

New Equipment |  

Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph ; Hand build ;

Shenzhen BQC Electronic CO.,Ltd.

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0.5 pitch csp searches for Companies, Equipment, Machines, Suppliers & Information



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