Aluminum and Copper type metal PCB (1~2 layer). Metal thickness 0.50~0.40mm, Dielectric 75~150um, Copper 0.50~10oz. 1.0W~3.0W/Mk. Outline by routing and punching. Sample lead time 5~7 days, Mass production 10~14 days.
Aluminum and Copper type metal PCB (1~2 layer). Metal thickness 0.50~0.40mm, Dielectric 75~150um, Copper 0.50~10oz. 1.0W~3.0W/Mk. Outline by routing and punching. Sample lead time 5~7 days, Mass production 10~14 days.
Available on 2mm, 0.8mm and 0.50" centers in various contact configurations and heights they are useful for PCB stacking applications.
1~6 layers, based film PI and PET, RA/ED Copper, Coverlay 0.50~2.0mil, Min. line/space +/-2mil, Outline by routing and laser cut. Sample lead time 5~7 days, mass production 10~14 days.
Perfectly suited for multi-layer, high aspect ratio, and high-Tg boards. For PCB UC/ST - series Diameter: ø0.20 ~ ø0.55mm PCB UC/ST Series drills are designed for the PCB market and are highly rigid. Diameter (D) Flute
New Equipment | Solder Materials
Solder Preforms offers accurate solder deposition for various soldering processes. Reel packaging provides opportunity of automation for efficient application. Custom Material may be formulated to unique material and dimensional requirements. Specif
1~6 layers, based film PI and PET, RA/ED Copper, Coverlay 0.50~2.0mil, Min. line/space +/-2mil, Outline by routing and laser cut. Sample lead time 5~7 days, mass production 10~14 days.
BDC F/D Series shanks made by specially chosen high hardness and rigid stainless steel. Performance much higher than general composite routers and much closer to solid routers. Composite type - Diamond Cut Diameter (D) Flut
Product number:CP03-C Humidity Range:1~99%RH ; 0~50。C Dimension: 68x45x25(mm) Accuracy:±3%RH(1%~80%RH) ; ±1。C(at25。C) Resolution: 1%RH ; 1。C Operating temp: 0~50。C Sensor drift:≦0.25 (%RH/yr) ; ≦0.05(。C/yr) Battery type: 2 pieces AAA battery
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
