The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
1000 (DF400+20C (Q=1/DF) X7R : D.F NPO Materials.; size case : 0805,1206,1210,1808,1812;===> X7R materials ; (2)Capacitor Arrays: capacitor arrays combine spearate multi-layer ceramic capacitor of hte same value in a single passive component, the pr
New Equipment | Assembly Services
China Double Sided Circuit Boards Fabricaiton and Assembly PCBA Turnkey Manufacturer 2 Layers circuit boards PCB FR4 1.6mm PCB fabrication and assembly 1oz PCB copper thickness Shenzhen PCB and PCBA manufacturer China turnkey contract electroni
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