The 3D Profiler is an automatic machine to measure the dent of the copper filled vias. The system offers the opportunity for 100% inspection to ensure the yield of the copper filling with inspection speeds of 5 minutes per panel and +/- 2 micron accu
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
Most flexible pick and place model with Vision offers technologically advanced features and automation with a 13" x 32" (330mm x 813mm) work area, 132 feeder positions where quick setup, ease of operation, and high reliablity are paramount. NEW LS60
The most flexible pick and place system, the LS60, offers technologically advanced features with a 13" x 32" (330mm x 813mm) work area, 144 feeder positions where quick setup, ease of operation and high reliablity are paramount. The highest
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Premium model with unmatched precision for low to medium production runs utilizing Cognex® Vision system. The LS40V is our most popular model with Vision. The LS40V offers technologically advanced features with a 13" x 22" (330mm x 559mm) work area
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