State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
New Equipment | Solder Materials
Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low
Economical Solution to Advanced, High-Speed AOI The VT-S500 is Omron's solution to providing next-generation, 3D inspection capability at minimal cost. With revolutionary 3D image processing, the VT-S500 accurately analyzes the topographical feature
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