New SMT Equipment: 288 (Page 1 of 2)

High reliability Copper Clad Laminate

High reliability Copper Clad Laminate

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

14-layer PCB with 3 Mils Minimum Line Width/Space, Made of FR4 Material

14-layer PCB with 3 Mils Minimum Line Width/Space, Made of FR4 Material

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Test voltage: 50 to 300V

Shenzhen Linghangda Electronic Co.,Ltd

High-density multi-layer PCB with 3 Mils Minimum Line Width

High-density multi-layer PCB with 3 Mils Minimum Line Width

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes

Shenzhen Linghangda Electronic Co.,Ltd

Eight-layer PCB with Immersing Au Surface Treatment, Used for Medical Equipments

Eight-layer PCB with Immersing Au Surface Treatment, Used for Medical Equipments

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20s Test voltage: 50 to 300V Package: vacuum packing for PCB, and good condition outer box; attached strong strap to reinforce outer box

Shenzhen Linghangda Electronic Co.,Ltd

Wafer Tweezers

Wafer Tweezers

New Equipment | Board Handling - Storage

Manual Wand for Semiconductor Wafer Handling Handle a fragile semiconductor silicon wafer softly but firmly without excessive touch. The surfaces of a wafer are never scratched in contrast to conventional metal tweezres. Our unique design (Pat

Fluoro Mechanic Co., Ltd.

Single Splice Tape for Siemens Machine

Single Splice Tape for Siemens Machine

New Equipment |  

Features: 1) Sizes: 8mm, 12mm, 16mm, 24mm 2) 2 colors: light yellow or deep yellow 3) Guarantees precise and secure connections of SMD tapes in taping and picking and placing machines 4) To avoid unnecessary stoppages of picking and placing mach

Shenzhen comofaje Tech.co.,Ltd

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper using KappAloy Solder

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper using KappAloy Solder

New Equipment | Solder Materials

Kapp Golden Flux has been designed specifically for soldering Aluminum to Aluminum, Copper, and Stainless Steel. Kapp Golden Flux is a golden colored, Chloride-Free, organic-based flux containing 56-60% active ingredients. It is a liquid consisting o

Solder Direct

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper

New Equipment | Solder Materials

Kapp Golden Flux™ has been designed specifically for soldering Aluminum to Aluminum, Copper, and Stainless Steel. Kapp Golden Flux™ is a golden colored, Chloride-Free, organic-based flux containing 56-60% active ingredients. It is a liquid consisting

Kapp Alloy & Wire, Inc

Kapp Copper-Bond Flux - High Temperature Soldering Flux

Kapp Copper-Bond Flux - High Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien

Kapp Alloy & Wire, Inc

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