The XP-143E provides high-speed placement of small and odd-form parts, ranging from 0402 to 20 x 20 mm, in a small footprint. The machine's front and rear supply units make the most out of your floor space by supplying up to 100 part types. Fuji's
Ceramic positive temperature coefficient PTC thermistor help provide protection against power cross, power induction surges and lighting surge defined in ITU, Telcordia, UL. Available in chip, radial-leaded coated and non-coated configuration. This
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new ge
New Equipment | Solder Materials
900M series 900M-T-RT 900M-T-R 900M-T-K 900M-T-SI 900M-T-I 900M-T-S11 900M-T-4CF 900M-T-4C 900M-T-S10 900M-T-3CF 900M-T-3C 900M-T-2CF 900M-T-2C 900M-T-1.5CF 900M-T-1CF 900M-T-
New Equipment | Test Equipment
Highly Accurate, Full Precious Metal Analysis The QSX-295T was developed with over twenty years of experience working with jewelers from New York City to Los Angeles. The analyzer offers a simple to operate solution for highly accurate identificati
IS200ACLEH EX2100 ACLE CARRIER CARD IS200ACLEH1A EX2100 ACLE CARRIER CARD IS200AVIFH BRIDGE INTERFACE IS200AVIFH1A BRIDGE INTERFACE IS200BAIAH PWM2/3 I/O BOARD IS200BAIAH1B PWM2/3 I/O BOARD IS200BICHH BRIDGE INTERFACE HIG IS200BICHH
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
New Equipment | Test Equipment
Non-multiplexed In-Circuit Test, Functional Test, Boundary Scan and Flash Programming Capability. Highest Throughput and Highest Quality Test Non-Multiplexed to 3,456 pins Fast Test Program Generation Safe Back-Driving 10V and Low Voltage Driv
New Equipment | Design Services
Our staff of senior level designers has extensive experience ranging from High Frequency RF, Large multi-processor, Power, Blind/Buried technology to ATE, Probe, Mix signal and beyond. At ACD the foundation of a good PCB starts with an emphasis on
New Equipment | Education/Training
Thermography is use in a broad range of applications. Thermography is used routinely for NDT, PPM, PdM and Condition Monitoring for electrical and mechanical systems, buildings and roofs, boilers and steam systems, and process equipment. Become a C
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