Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering. The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexib
The largest format AOI solution for large board sizes or backplane inspection. The Spectra Series Tri-Color Technology system is MVP’s large format AOI solution. The Spectra has a standard handling size of 24 x 24 inches (610 x 610mm). The optional
S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
Vantage™ S22 Plus is a cost-effective solution that delivers top-of-the-line AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT / PTH environments. DPIX™ 3-D Technology
Reliable optical inspection of wave, reflow, pre-reflow and selective soldering. More than an entry into AOI Optimal, ergonomic loading through large opening angle Superior resolution, reliable 01005 and fine-pitch inspection Scalable camera t
Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th
Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed
.jpg)
