New SMT Equipment: ape (Page 1 of 2)

Chipper

New Equipment |  

An affordable, totally integrated system for "SMT" rework and repair.

A.P.E. South

Box Builds & Fulfillments

Box Builds & Fulfillments

New Equipment |  

In addition to our printed circuit board assembly services, American also provides cost effective box build and fulfillment services. If you need help with production and shipments to customers, we are ready to be your complete contract manufacturing

A.P.E. - American Precision Electronics, Inc.

Electronic Contract Manufacturer

Electronic Contract Manufacturer

New Equipment |  

When it comes to being a contract manufacturer, American provides the personalized service that a larger contract manufacturer doesn't provide, as well as the technical and manufacturing capabilities that our smaller competitors can't provide.

A.P.E. - American Precision Electronics, Inc.

Engineering & Testing Services

Engineering & Testing Services

New Equipment | Test Services

Our engineering services are integrated and comprehensive from component sourcing, through process control and manufacturing, to final testing. Our experienced & professional engineers review your printed circuit board assembly design prior to produc

A.P.E. - American Precision Electronics, Inc.

Chipmaster

Chipmaster

New Equipment |  

From plastic sockets to ceramic BGA components, the Chipmaster Rework system provides a controlled environment, which cares for your repair process. Features simple operation with "Timed" process control and selected thermal profiling

A.P.E. South

Flo-master

Flo-master

New Equipment |  

The Flo-master BGA/SMT rework and repair system is a fully integrated dual, top and bottom heat system designed to handle ceramic BGA's, military type boards and commercial applications requiring an efficient level of power versus temperature

A.P.E. South

Sniper Flo-master

Sniper Flo-master

New Equipment |  

The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices

A.P.E. South

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