1．Description of products ： INFRARED tically by micro-computer control. Can satisfy a dissimilarity SMD、BAG Soldering a request. Whole soldering process to complete automatically, easy to use, Adoption fast infrared radiation and circulation the wi
170AAI03000 170AAI14000 171CCC98030 171CCS70000 171CCS70010 171CCS76000 171CCS78000 172JNN21032 172PNN21022 172PNN26022 174CEV20030 174CEV30010 170AAI52040 170AAO12000 170AAO92100 170ADI34000 170ADI350
New Equipment | Wave Soldering
The modular system for medium production volumes, to be soldered in ambient atmosphere or with local nitrogen inertion of the solder bath. With the wave soldering system PowerWave, SEHO consequently realized a machine concept that offers a remarkab
New Equipment | Design Services
Our design services – the total package. At i3, we are the premier supplier of leading-edge PCB and semiconductor package designs. We maintain a highly skilled team of design engineers with more than 170 years of collective experience in the desi
Lite Fast 3010-M is a low viscosity, one-component conformal coating. It was specifically developed for printed circuit boards (PCBs) as well as hybrid and integrated circuits for military application. Low viscosity enables the resin to flow betwee
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.
FRN3.7F1S-4C FRN5.5F1S-4C FRN7.5F1S-4C FRN11F1S-4C FRN15F1S-4C FRN18.5F1S-4C FRN22F1S-4C FRN30F1S-4C FRN37F1S-4C FRN45F1S-4C FRN55F1S-4C FRN75F1S-4C FRN90F1S-4C FRN110F1S-4C FRN132F1S-4C FRN160F1S-4C FRN200F1S-4C FRN2
New Equipment | Wave Soldering
"Best in Class" Wave Soldering Machines with the Lowest Running Costs. The POWERFLOW series of wave soldering machines were specifically designed to meet the challenges of lead free soldering! The machines highlight a 400 mm or 16" bo
New Equipment | Assembly Services
PCB process capability Base material: CM1, CM3, FR1, FR4, Metal based Layer: 1 to 24 layers Board thickness: 0.4mm to 3mm Copper thickness: 0.5oZ, 1oZ, 2oZ Min Copper thickness in hole: 0.02mm Max working size: 400*610mm Surface finishing: HAS
.jpg)
