When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
New Equipment | Coating Materials
AccuSpec Electronic Services has the capability of producing both low and high volumes of potting assemblies ranging from the simplest of coating tasks to the most difficult potting needs. A variety of potting materials and conformal coatings are ava
New Equipment | Test Equipment
Have a product that you need tested and configured to end-user requirements? Accu-sembly makes it easy for you by providing this service right on the production floor! Your assemblies straight from our floor to the testing department makes one less s
0.15mm diameter). Adhesives Highest precision, even for delicate conductive adhesives with relatively large particles. Trouble free precision processing of abrasive media. Dispenser head heating prevents ‘stringing’. Potting Compou
1. The machine is designed for fast dispensing placement accuracy and repeatability without the expense for fast dispensing placement accuracy and repeatability ,even without the expense of coordinated X.Y moving ,it seamlessly integrates windows
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
New Equipment | Curing Equipment
TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing/drying of coatings, adhesives and potting compounds. They are easy to integrate with automated spray and dispense systems and are equipped with a unique downdraft exhaus
For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applicati
25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic
