New Equipment | Rework & Repair Equipment
Specification: Rated Power: 4000W Rated voltage:AC220V /AC110V optional The first upper zone power: 800W Second temperature lower power: 800W Lower part of the preheating temperature zone Power: 2400W Dimensions: L500mm * W420mm * H550mm Weigh
New Equipment | Rework & Repair Equipment
The EXPERT 04.6 systems with Hot Air and IR Technology are complete rework stations for manual soldering of SMDs, residual solder removal and dispensing. Soldering profiles can be easily established and supported with the supplied software packet Eas
Machine details: Back device table doors installed. New Type of Nozzle Holder Shaft Assembly. Machine Software Version: V1.27 Machine Vision Software Version: V3.00 Machine Mfg Date: NOV. 1999 Machine Working Hours: 15,024 Type/Quantity of noz
New Equipment | Assembly Services
Factory supply cable utp cat5e and cat6 lan cable 305m (Rhonda(at)z-crown.com cable utp cat5e: 1.Conductor:24AWG,bare copper 0.51 +/-0.01 mm, 2.Insulation: High density polyethylene, minimum thickness of 0.19 mm 3.Conductor diameter 0.92 +/- 0
New Equipment | Assembly Services
Factory supply cable utp cat5e and cat6 lan cable 305m (Rhonda(at)z-crown.com cable utp cat5e: 1.Conductor:24AWG,bare copper 0.51 +/-0.01 mm, 2.Insulation: High density polyethylene, minimum thickness of 0.19 mm 3.Conductor diameter 0.92 +/- 0
The AV862 Series of AOI solutions from ASC International provides manufactures with a solid platform to validate the overall variables associated with component placement. Absence / presence, polarity, OCR, solder inspection and lead quality can all
The OvenWATCH® system is designed to continuously monitor the quality of PCB assemblies as they pass through your reflow ovens. Now the OvenWATCH® system can provide you and your customers with the confidence of knowing that the quality assurance of
New Equipment | Test Equipment
Specifically designed for high-performance communications applications, the CSA8000B Communications Signal Analyzer is the ideal tool for design evaluation and manufacturing test of data-com and telecom components, transceiver sub assemblies and tran
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Rework & Repair Equipment
Underheater for demanding soldering Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill. MARTIN offers a wide choice of underheater
