New SMT Equipment: back to back bga (Page 1 of 2)

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

Taping for electronic components /diode/  6mm*500m,6mm*3000m/the tape mainly applied to masking diode etc.

Taping for electronic components /diode/ 6mm*500m,6mm*3000m/the tape mainly applied to masking diode etc.

New Equipment | Components

size:6mm*3000m Backing: flat back paper Adhesive: rubber Thickness: 0.16 ±0.01mm Adhesion (N/in): 7 Ball tack (#14): 10↓ Holding power: 72hrs Tensile strength (N/in): 150↑ Elongation (%): 2↑ Applications: used in masking of diode and for s

Shenzhen Shunyuan Tapes Co.,Ltd.

Keysight Agilent HP 8720D Microwave Vector Network Analyzer; 50 MHz to 20 GHz

Keysight Agilent HP 8720D Microwave Vector Network Analyzer; 50 MHz to 20 GHz

New Equipment | Test Equipment

The HP Agilent 8720D Network Analyzer features a frequency range of 50 MHz to 20 GHz, a drastically faster processor compared to earlier versions, a built-in fast sweeping synthesized source, an integrated solid-state switching S-Parameter Test Set,

Recon Test Equipment Inc.

YSC Scope 70, 130 & 7014 for BGA & Micro BGA

YSC Scope 70, 130 & 7014 for BGA & Micro BGA

New Equipment | Inspection

YSC Scope (Model YSC-70, YSC-130 and YSC-7014) with integrated LED lighting and camera are ideal for BGA, CSP and QFP inspection. Interchangeable 90 degree horizontal viewing prism tips from 0.5 mm to 2.0 mm size can be used for various stand off hei

YSC Technologies

Tacky Assembly Flux

Tacky Assembly Flux

New Equipment |  

Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and

Hallway International Trading Co.,Ltd.

BGA Rework Stencils

BGA Rework Stencils

New Equipment | Solder Paste Stencils

BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precis

FCT ASSEMBLY, INC.

Assembly Services

Assembly Services

New Equipment |  

SST offers a full range of electronic manufacturing services to its customers. With the ability to offer both turn-key and consignment manufacturing for nearly any size project, we stand ready to become your manufacturing partner. SST offers a wide r

Senior Systems Technology

FUJI IP – 3 Fine Pitch Placer

New Equipment |  

Model:FUJI IP – 3 5000 w/MTU-4R Date of manufacturing: June, 1995 Hours Run:: 30,884 Hours SPECIAL REMARKS:: With right side MTU installed, With Vision Monitor, Reject Part conveyor installed. Machine Software Version: V2.52 Machine Vision Sof

Used Machine Dealers

SMT reflow oven R50CD with mesh belt and pin chain

SMT reflow oven R50CD with mesh belt and pin chain

New Equipment | Soldering Robots

Model  R50CD (Computer) Heating zones  Upper 5/lower 5 Length of heating zone 1730mm PCB width  Chain 300mm, mesh 350mm Conveyor chain width range  50-300mm PCB direction  L→R  or (R→L) Chain fixing Front fix(back fix is optional) Conveyor hei

Beijing Glichn S&T Development Co.,Ltd

JOHNSON VALVE

JOHNSON VALVE

New Equipment | Components

108038  JSNA11A-1C  CONTROL TEMPERATURE 20' CAP 96616  JSNA11B-1C  CONTROL TEMPERATURE 20' CAP 166053  JSNA19AAC-9C  DIFFERENTIAL FIXED 100/240 5F 207381  JSNA19ABA-40C  CONTROL TEMP REM BULB 104566  JSNA19ABC-24C  THERMOSTAT REMOTE BULB 98260 

zhengzhou yuzhe electronic technology co.,ltd

Previous 1 2  

back to back bga searches for Companies, Equipment, Machines, Suppliers & Information