New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Solder Materials
SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.
New Equipment | Test Equipment
The PogoPlus® Series address the unique demands of loaded board testing, featuring an enhanced version of the legendary bias-ball design to virtually eliminate "false opens". ECT offers a full range of sizes and tip styles to accommodate all manners
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
One PCB design for test and production. Design your PCBs without socket mounting holes or hardware considerations and eliminate the need for a special test socket footprint. Grypper provides excellent signal integrity for today's high-frequency appli
The art of combination. . . the essence of thin film technology. Since 1980 Thin Film Technology has been designing and manufacturing thin film components in an ISO9001 certified operation. From this factory quality product serving the computer, test
New Equipment | Test Equipment
The CALOTEST® is widely used for analyzing coatings with thicknesses of between 0.1 and 50 µm. The simple ball-cratering method is a fast and accurate means of checking the thickness of any coating, whether a single or multilayered stack. Typical exa
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
