Sale Type: Make Offer, Location: Chongqing, China Close Date: Mar 31, 2025 Contact: Eric Zhang: Tel.:+ 86 139 1795 6751 E-mail: Eric.Zhang@liquidityservices.com Chris Guo: Tel.:+86 188 1788 2689 E-mail: Chris.Guo@liquidityservices.com A
Sale Type: Make Offer, Location: Chongqing, China Close Date: Mar 31, 2025 Contact: Eric Zhang: Tel.:+ 86 139 1795 6751 E-mail: Eric.Zhang@liquidityservices.com Chris Guo: Tel.:+86 188 1788 2689 E-mail: Chris.Guo@liquidityservices.com A
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Solder Materials
SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.
New Equipment | Test Equipment
The PogoPlus® Series address the unique demands of loaded board testing, featuring an enhanced version of the legendary bias-ball design to virtually eliminate "false opens". ECT offers a full range of sizes and tip styles to accommodate all manners
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
New Equipment | Test Equipment - Bond Testers
Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient load can be applied to the bo
One PCB design for test and production. Design your PCBs without socket mounting holes or hardware considerations and eliminate the need for a special test socket footprint. Grypper provides excellent signal integrity for today's high-frequency appli
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