Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
Tape Splicer, Splicing Tape, Tape Splicer, Splice Tape for splicing carrier tapes, mag-d electronics, magdelectronics, mag-delectronics, mag-d, mag d electronics, mag d, Surface mount feeders for bare dies and flip chips, Tape splice and splice tape
Tronixlink's Electronic Contract Manufacturing Service (EMS) PCBA layout Prototype builds Printed Circuit Board Assembly (PCBA) - Single sided , Double sided , Multilayer, Backplanes, Industrial Power boards, Wire Wrap boards, Fine-line , Analog ,
SIPLACE D1 � Flexible Placement Machine With the flexible end-of-line machines SIPLACE D1 and SIPLACE D1s the SIPLACE team completes the new SIPLACE D-Series generation. The new placement machines can be alternatively equipped with one (SIPLACE D1s)
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
Automatic, High Accuracy Desktop Wafer Inspection For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of sur
Highly Accurate Fully Automatic Wafer Inspection with Handling Unit For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive
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