Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
New Equipment | Board Handling - Storage
Conductive Nestable Durable CP Kitting Trays offer versatile in-plant handling & storage for static sensitive components. CCI vacuum forms the trays from durable .090 mil conductive plastic. Die-cut-drop-in covers available for sizes indicated
Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dis
To compliment our wafer dicing and inspection processes, Syagrus Systems offers fully automated die sorting services. Whether you require high volume production or a single wafer prototype build, Syagrus Systems has the die sorting solution for you.
Heavy-Duty Universal Lead Cut & Form Machines One Machine Does it All: TO-247, TO-126, CKO, TO-237, HALL CELL, TO-92, TO-18, TO-5 LED, TO-220, TO-202, TO-218 Hand-Feed, Tube-Feed, Bowl-Feed SIMPLE TO OPERATE: Timed Dual Pneuamtic Cylinder Actua
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Tape Splicer, Splicing Tape, Tape Splicer, Splice Tape for splicing carrier tapes, mag-d electronics, magdelectronics, mag-delectronics, mag-d, mag d electronics, mag d, Surface mount feeders for bare dies and flip chips, Tape splice and splice tape
Tronixlink's Electronic Contract Manufacturing Service (EMS) PCBA layout Prototype builds Printed Circuit Board Assembly (PCBA) - Single sided , Double sided , Multilayer, Backplanes, Industrial Power boards, Wire Wrap boards, Fine-line , Analog ,
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
