Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow
SALES OF NEW AND USED EQUIPMENT TO THE PCB ASSEMBLY INDUSTRY. SMT AND T/H--PICK AND PLACE,----SCREEN PRINTERS--REFLOW OVENS--A.O.I.--A.X.I.-----CS-400 COMPONENT LOCATORS--LEAD FORMING EQUIP.----SOLDERING MACHINES--AQUEOUS AND SOLVENT CLEANERS--MANUFA
Suppliers of New and Reconditioned Equipment for the Electronics Assembly Industry. We are the exclusive representative of Hitachi High Technology in Mexico and the Texas Border. We also sell a complete line of new economical assembly equipment
Front End: Previously owned (new & used) equipment used for fabrication of semiconductor wafers and similar devices. Includes coater/developers, CVD, PECVD, etch tools, steppers, sputtering tools, ashers, evaporators. Back End: Previously owned (
PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
The Profiling Machine for your Profile Machine The ProBot automatically verifies whether each PCB is processed to specification in the reflow oven. The suspect PCBs then can be sent off to batch X-ray. Because the typical batch X-ray machine only in
All in One N2 Reflow Oven. A next generation reflow oven that realizes ultra-low power consumption, the lowest N2 consumption and a high efficiency flux collecting system complying CO2 emission regulations. N2 Generator Fixing Type Easy M
Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, e
Cost effective manual stencil printer compatible with standard frames covering a 16" X 18" (406mm x 457mm) print area. The SPR-25 benchtop, manual stencil printer is designed for low to medium volume surface mount assembly runs. Fine X,Y, Z, and the
Lead Free 4 Top 4 Bottom plus 1 cooling zone Vintage: 2003 Specs: Substrate size(min/max): L100xW25mm/ L250xW75mm Substrate Height : 10mm max (upper) Transfer method : wire belt conveyor method Transfer height : 900 A+/- 20
