The revolutionary Ersascope 3000 optically inspects hidden solder joints without the limitations of X-ray. See solder joints in color, measure stand-off heights, radius, and angles. Add text to images and save in databases or email to suppliers. T
Now for nearly a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints with the patented ERSASCOPE technology. Industry experts including IPC recognize the critical importance of using ERSASCOPE technology
The QM3000 is a great application for small & medium production. This model only use air actuated feeder. Provide you great speed and accuracy of placement. Visit our website for more detal. You can contact me at (909) 393-8700 or email me at vee@s
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
108038 JSNA11A-1C CONTROL TEMPERATURE 20' CAP 96616 JSNA11B-1C CONTROL TEMPERATURE 20' CAP 166053 JSNA19AAC-9C DIFFERENTIAL FIXED 100/240 5F 207381 JSNA19ABA-40C CONTROL TEMP REM BULB 104566 JSNA19ABC-24C THERMOSTAT REMOTE BULB 98260
FOXBORO 11GM-CS1 PRESSURE XMTR FOXBORO 1210-03-D PHASE DET/AMP FOXBORO 130M-N2 PNEUMATIC CTRL FOXBORO 130M-N4 PNEUMATIC CTRL FOXBORO 130M-N5 PNEUMATIC CTRL FOXBORO 13A TRANSMITTER FOXBORO 13A1-MKS TRANSMITTER FOXBORO 13AH-S2 TRANSMITTER FOXBO
| 1 |
.jpg)
