Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
PCB Assembly 9 SMT lines and 2 DIP lines Min.Chip size:0201 BGA and Bonding are available ROHS compliance Can buy components for customers Capability: 4 million chips can be assembled each day. Our sub-factory one offer PCB assembly service.
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Our Wave Solder Fixtures increase productivity and eliminate defects in your pcb assembly process. This type of fixture supports the pcb on all four sides eliminating warpage that can cause solder skips and bridges or pcb flooding. They also elim
iJet-Table Dispenser Model 250 & 350: SMT and PCB Packaging, Underfill, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the n
SMT and PCB Packaging, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated.
Increased Dispense Area over SD6 Series for Underfill, Glob Top, Dam & Fill, LED Packaging, Surface Mount Adhesive Dispensing, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
