New SMT Equipment: bga csp 3500 (Page 1 of 11)

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

New Equipment | Dispensing

ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa

ASYMTEK Products | Nordson Electronics Solutions

ZM-R750 PC Controlled BGA Rework Station

ZM-R750 PC Controlled BGA Rework Station

New Equipment | Rework & Repair Equipment

The Model ZM-R750 BGA Rework station features Industrial Computer control that will automatically save the temperature curve to generate a large number of log files to facilitate the recall of historical parameters for traceability. Ideal for those c

Precision PCB Services, Inc

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

New Equipment | Dispensing

The NexJet® 8 Jetting System with patented ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-owner

ASYMTEK Products | Nordson Electronics Solutions

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Hanwha HM520 Pick and Place Machine

Hanwha HM520 Pick and Place Machine

New Equipment | Pick & Place

Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm​ weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch

Qersa Technology Co.,ltd

Dummy BGA Components

Dummy BGA Components

New Equipment | Components

BGA, flex-BGA, uBGA, CBGA and CSP Dummy Components with daisy chain for solder practice and temperature profiling.

TopLine Dummy Components

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

SMD/PTH rework manual stations

SMD/PTH rework manual stations

New Equipment | Rework & Repair Equipment

Thru-hole components SMD components BGA, µBGA, CSP components http://www.selen.hr/pokaz_kategorie.php?cid=44

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Void Free Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
Best SMT Reflow Oven

High Throughput Reflow Oven
Assembly Automation Technology

Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India