New Equipment | Solder Materials
Kester Tacky Solder Fluxes (TSFs) are the industrial standard for Flip Chip and BGA Sphere Attach. With viscosities optimized for high speed application and holding of a chip or sphere in place prior to reflow, Kester TSF’s enable wide process window
Desktop covenyor Reflow Oven R350 from prototyping to full production. Desktop covenyor Reflow Oven R350 from prototyping to full production. Product Description Introduction: R350 mini reflow oven R350 is the first inline lead free reflow oven
New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 xbox one controller motherboard repair machine price WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main use
New Equipment | Rework & Repair Equipment
Full automatic BGA rework station WDS-750 all motherboard repair machine for iphone PS4 repairing WDS BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main u
The revolutionary Ersascope 3000 optically inspects hidden solder joints without the limitations of X-ray. See solder joints in color, measure stand-off heights, radius, and angles. Add text to images and save in databases or email to suppliers. T
New Equipment | Solder Materials
New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura
New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
New Equipment | Rework & Repair Equipment
BGA rework BGA welding BGA welding equipment Power source: AC220V±10％ 50/60Hz Work rate: 4500 W Heating power: Temperature range of the upper temperature range of 800 W lower temperature range of the IR 2400 W, 12
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
