New SMT Equipment: black residue (Page 1 of 1)

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

Typhoon T-8 Chemistry Zero-Discharge Cleaner

Typhoon T-8 Chemistry Zero-Discharge Cleaner

New Equipment | Cleaning Equipment

Zero-Discharge Cleaner with Dry Isolation: Save on Chemical Costs and Maintain Chemical Concentration Aqua Klean Systems introduces the Typhoon T-8 Chemistry Zero-Discharge Cleaner, a new way to clean RMA, No-Clean, and Water Soluble (OA) fluxes. T

Aqua Klean Systems

Automatic Screen Printer

Automatic Screen Printer

New Equipment | Solder Paste Stencils

DESEN Classic 1008  SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum

Shenzhen Gosmt Technology Co., Ltd

Automatic Screen Printer

Automatic Screen Printer

New Equipment | Solder Paste Stencils

DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6

Shenzhen Gosmt Technology Co., Ltd

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