Hanwha SM485P Pick and Place Machine Placement speed: 12,000 CPH (Optimum) Machine dimension: 1650*1679*1993mm Weight: Approx 1600kg SM485P is a multifunctional Hybrid Pick and Place Machine. In addition to SMD components, it can quickly and reliabl
JUKI LX-8 Pick and Place Machine Applicable Components: 0201Board size:410×400mmFeeder inputs:136placement capacity:105,000CPHProduct description: JUKI LX-8 Pick and Place Machine,Applicable Components: 0201,Board size:410×400mm,placement capacity:1
New Equipment | Solder Paste Stencils
SMT Prototype Stencils are laser cut solder paste prototype stencils designed to work on their own for hand printing. These laser cut prototype stencils do not need to be permanently glued in a frame. These so-called framelessstencils are less expens
Photonic Products is the specialist distributor of blue-violet laser diodes, red and infrared industrial laser diodes, optical lenses and blue, white and infrared LEDs. We offer you competitive prices and fast worldwide delivery. We hold inventory o
Photonic Products Ltd, the UK optoelectronics device manufacturer and laser diode specialist, has launched a 25mW version of their hugely popular 405nm (blue-violet) Photon laser diode modules with TTL modulation. The 25mW output power offered by th
Soldering, Welding, Marking, Wirestripping
New Equipment | Solder Paste Stencils
Repair stencils and Reballing stencils in a lasercuting and laserwelding production process Since more than 10 years LaserJob is manufacturing repair stencils in a lasercut and laserwelding process. With the introduction of the SMD – Technology the
The most flexible pick and place system, the LS60, offers technologically advanced features with a 13" x 32" (330mm x 813mm) work area, 144 feeder positions where quick setup, ease of operation and high reliablity are paramount. The highest
Our 2D fixed-mount readers feature the latest imaging technology for decoding both 2D symbols, such as Data Matrix, and linear barcodes. Specialty readers are available for high speed reading, ESD-sensitive applications, and decoding the most challe
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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