Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com. HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch
IPC 6012 Qualification and Performance Specification for Rigid Printed Boards This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or withou
New Equipment | Solder Materials
Qualitek's Stencil Kleen products are designed to provide easy cleaning of misprinted circuit boards, and stencils. At the production line, Stencil Kleen #11 provides fast drying without leaving a film, like most alcohol-based cleaners. Compatible wi
New Equipment | Cleaning Agents
LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t
X-KAR� Brand provides Rework/Repair and SMT Assembly Equipment for assembly and repair of PCB's with Surface Mount Technology Components. Rework equipment handles all standard parts plus fine pitch QFP, BGA, CSP. SMT Rework Packages include: Hot Ai
Develop complete applications with ease The JTAG ProVision software suite is used to generate boundary-scan tests and in-system programming applications for assembled PCBs and systems. This professional development tool is fully automated and suppo
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and techn
New Equipment | Test Equipment
The boundary-scan I/O modules provide an effective means of increasing test coverage on the target board and improving the diagnostic resolution of boundary-scan testing. The modules are grouped into two general classifications: general purpose digit
