The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well as lifted lead inspection and sensitive solder joints & bridges. The 2K Series improve
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
New Equipment | Rework & Repair Equipment
Standard Features: 600 W - Dedicated Solder Scavenger Heater Dynamic Height Sensing - real time control of scavenger gap Dual Gas Inlets - (CDA & N2 with Two Stage Pressure Regulator) Top Heater Gas Saver - (saves CDA or N2 during preheat) 18
National Instrument NIAI110 I/O BOARD 8POINT ANALOG VOLTAGE/CURRENT National Instrument 77901501 MODULE ANALOG INPUT 4CHANNEL 24BIT National Instrument NIFP2000 CONTROLLER INTELLIGENT ETHERNET National Instrument 77825401
New Equipment | Test Equipment
Description This product is discontinued. Support life for the 8757D will be through January 1, 2016. Accessory products for the 8757D will continue to be orderable through November 30, 2014. Support life for the accessories will be through Januar
New Equipment | Test Equipment
Description This product is discontinued. Support life for the 8757D will be through January 1, 2016. Accessory products for the 8757D will continue to be orderable through November 30, 2014. Support life for the accessories will be through Januar
New Equipment | Board Handling - Storage
PROMATION offers a servo driven "Extend to Deliver" passageway shuttle station. The shuttle gate provides a normally open pathway (800 mm) and extends to deliver product when available. The shuttle gate uses 3 look across sensors and bump detection
New Equipment | Board Handling - Conveyors
PROMATION’s accumulation conveyors provide a low friction method to transport and accumulate PCBs or pallets on a steel roller chain design. Accumulator may be programmed for: continuous run mode, progressive indexing, or be configured with multiple
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
