This unit is used to depanel PCB by high torque spindle and separate the arrayed PCBs as off-line. Easy teaching by CCD Camera Equipped with Safety slide door Easy operation by 3 axis servo and control by industrial PC Easy to change
Glenbrook RTX-MINI Portable X-Ray Inspection System, Manufactured 1996, lightly used since re-manufacture (refurbishment) in 2006 Manufacturer's Description: Glenbrook's RTX-Mini is a compact, truly portable X-ray inspection system, designed for
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger’s MicroGraph System allows the creation of high-quality crimp cross-sectional images in a fraction of the time needed with “conventional” methods. The system is comprised of modular components that can be combined according to
Machine details: Back device table doors installed. New Type of Nozzle Holder Shaft Assembly. Machine Software Version: V1.27 Machine Vision Software Version: V3.00 Machine Mfg Date: NOV. 1999 Machine Working Hours: 15,024 Type/Quantity of noz
Dingji technology company is specialized in the filed of component level industrial electronics repair,CyberOptics laser repair:Juki laser unit(KE730/740/750/760/2010/2020/2030/2050/2060/FX-1/2070/2080),Yamaha laser,Samsung laser,Tenryu laser,Philips
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
00341181S01:Star, mounted, DLM1 00319748S02:Segment SP 12 00367768:Valve Drive, Reject Circuit, DLM2 00368075:Valve Drive, Placement Circuit, DLM2 00335990 DP motor 03020626 STAR 00341780 DP motor 00349432 motor 00349433 motor 00335989 HS50 vac
SMT Pick & Place of PCB Prototypes The LPKF ProtoPlace S is an ergonomically designed, semi-automatic pick & place system for the professional assembly of SMT printed circuit board prototypes and small batch projects. The ProtoPlace S quickly assem
S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
A wide work scope range : able to handle large PCBs 50x50 mm 530x460mm. Variable component placement ability 0603mm (0201 inch)chips, QFP,BGA,CSP, odd-form parts Four high-speed precision head-based operation Can handle up to four - 18mm parts at
