The Finesse� offers a throughput rate of 12,500 CPH with a vast feeder capacity of 198 x 8mm tapes plus Internal Matrix Tray positions in a remarkably compact footprint. This machine incorporates all of the sophistications which are common throughout
A wide work scope range : able to handle large PCBs 50x50 mm 530x460mm. Variable component placement ability 0603mm (0201 inch)chips, QFP,BGA,CSP, odd-form parts Four high-speed precision head-based operation Can handle up to four - 18mm parts at
Dual Operation An advanced compact digital controlled production soldering and SMD component rework system, suitable for high-capacity soldering and temperature-regulated installation and removal of PLCC/SOIC types, together with chip resistors and
Altronics develops individualized material strategies for each of our customers. Our state of the art ERP system maximizes flexibility, while allowing us to minimize cost and excess material liability to you. Consignment: 100% customer supplie
Specifications: Features: As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and ty
Specifications: Features As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and typ
Specifications: Features As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and typ
CC Electronx offers a full range of SMT assembly equipment capable of placing 0402,BGA,mBGA and fine pitch devices on your circuit boards. CC Electronx SMT assembly lines are fully automated and conveyorized. We have the capability to handle variou
Leading optoelectronics companies are looking to PROMEX for their outsource manufacturing needs. Our core competencies in microelectronics assembly technologies compliment our thorough understanding of high-speed circuit layout and process engineerin
MODEL 80 - For medium to large boards Overall Dimensions: L: 476 W: 508 D: 457 mm Board Capacity: W: 457 D: 457 mm - Standard card guides are 317,5 mm deep, optional 457 mm guides for very large boards. - 75 numbered slots measure 2,8 x 3,9 mm on a 5
