New Equipment | Assembly Services
Printed Circuit Board Assembly (1206 to micro BGAs) (Rohs - non Rohs) [All paste types ( water soluble, no clean etc)]
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Cleaning Agents
AQUANOX® A4708 is a neutral range pH chemistry designed to rapidly clean under densely populated low-gap PWB assemblies. AQUANOX® A4708 is effective on all flux types including no-clean and water soluble residues. AQUANOX® A4708 is specifically form
New Equipment | Cleaning Agents
AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can be used in multi-p
New Equipment | Cleaning Agents
IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues
New Equipment | Cleaning Agents
AQUANOX® A4625 is a versatile aqueous cleaning chemistry designed to clean the latest lead-free residues while providing brilliant mirrored solder finishes. Easy to use, AQUANOX® A4625 is environmentally friendly, has a long tank life and is safe fo
New Equipment | Cleaning Agents
Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa
New Equipment | Solder Materials
To meet the increased demands imposed by the higher operating temperatures involved in successful lead free soldering, DKL Metals have released new flux products designed specifically for this environment. A selection of the most popular, incorporati
New Equipment | Cleaning Agents
KYZEN® E5615 is an aqueous based cleaner designed to be the fastest drying chemistry in the industry. E5615 is shipped ready to use and successfully removes unreflowed solder paste from stencils and related equipment. Fast Drying No Rinse Require
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