New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
Provides moisture barrier and ESD protection in "dry-packaging" of static and moisture sensitive components, PCB's and disk drive assemblies.
New Equipment | Board Handling - Storage
Effective moisture damage solution that improves yields. http://eurekadrytech.com/fast-super-dryer/tus-101 Capacity: 93 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing door for 30 seconds or les
New Equipment | Board Handling - Storage
Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-101 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Stands, 1 M ω Ground Wire Model: SDC-101 Fast Super Drye
New Equipment | Board Handling - Storage
Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-2001 Model: Eureka SDC-2001 Fast Super Dryer Capacity: 1314 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% R
New Equipment | Board Handling - Storage
Eureka TUS-501 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-501 Model: TUS-501 Fast Super Dryer Capacity: 372 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing doo
New Equipment | Board Handling - Storage
SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: Model: SDC-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% RH within 30 minutes after accessing door for 30 seconds or less. Ex
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Reflow cycle - runs the oven through the pre-defined temperature profile.> Bake cycle - used to drive the moisture from moisture-sensitive components.>
MSD (Moisture Sensitive Device) control is widely recognized as the most critical and difficult material tracking application. MSD has a direct impact on the near- and long-term reliability of the finished product. Cogiscan��s MSD Control offers t
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