New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Through the process of CNC routing, we are able to cut with precision electronic insulation products including thicker gauge materials. We also process composite materials such as G-10, FR4 and other materials that are not easily die cut.
Hanwha DECAN F2 Pick and Place Machine High Speed:120,000 CPH Ultra Slim Design with a Total Length of 1.25m Applies High Rotary Modular Head Side-view Vision System Product description: Hanwha DECAN F2 Pick and Place Machine High Speed SMT Modular
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature reduction of 20??C is typical 2.easily added t
Automotive headliners (www.sun-tec.ch)containing LEDs may be produced by integrating LED Chains behing perforated composite headliners. This very time consuming handwork may be substituted integrating SUN-TEC LED embedded Films into the headliners co
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