New SMT Equipment: conductive polymers (Page 1 of 2)

IPC Standards

IPC Standards

New Equipment | Education/Training

IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics

Association Connecting Electronics Industries (IPC)

Overvoltage

Overvoltage

New Equipment |  

SurgX� is a unique polymer-based voltage variable material that is a combination of conductive and non-conductive particles contained in a polymer matrix. The SurgX product family is designed to protect sensitive electronic circuits from the damaging

Cooper Electronic Technologies

LPKF ProConduct® - Through-hole Conductivity System

LPKF ProConduct® - Through-hole Conductivity System

New Equipment | Through-Hole

In-House PCB Through-Hole Plating without Chemicals The LPKF ProConduct® introduces revolutionary technology to produce plated through-holes, which does not require a plating tank or potentially hazardous processing chemicals. This compact system is

LPKF Laser & Electronics

Multilayer Mixed Dielectric PCB

Multilayer Mixed Dielectric PCB

New Equipment | Components

Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry.  Multilayer Mixed Dielectric PCB Specifications:

Standard Printed Circuits, Inc.

Multilayer High Frequency Coupler

Multilayer High Frequency Coupler

New Equipment | Components

This multilayer, high-frequency coupler, shown above, is used within a communications application for the telecom industry. Multilayer High Frequency Coupler Specifications: Product Description This Multi-Layer High-Frequency Coupler is used with

Standard Printed Circuits, Inc.

Parmod (r) Conductive Inks

New Equipment |  

Parmod�, Parelec Inc�s patented conductive ink technology, enables the formation of continuous-phase pure metallic conductors at relatively low temperature�making them suitable for application to polymer substrates. Parmod� inks, pastes and toners ca

Parelec Inc.

Anisotropically Conductive Adhesives

Anisotropically Conductive Adhesives

New Equipment | Materials

For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and

Zymet, Inc

TM 230 Solderable Conductive Adhesives

TM 230 Solderable Conductive Adhesives

New Equipment | Materials

TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as

YINCAE Advanced Materials, LLC.

Thermally Managed - Heat Dissipating Printed Circuit Board Technology

New Equipment |  

Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin

ThermalWorks

PCB & Semiconductor Packaging Materials.

PCB & Semiconductor Packaging Materials.

New Equipment | Materials

Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian

i3 Electronics

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