Copper-Invar-Copper, Copper, Aluminum cores are available. MIL-P-55110 approved. Current designs include a 16 layer polyimide package with an active 50 mil CIC layer.
The 3D Profiler is an automatic machine to measure the dent of the copper filled vias. The system offers the opportunity for 100% inspection to ensure the yield of the copper filling with inspection speeds of 5 minutes per panel and +/- 2 micron accu
New Equipment | Assembly Services
Heavy Copper Printed Circuits supplier Saturn Electronics Corp., bare printed circuit board manufacturer, was one of North America's largest users of heavy copper PCB laminate, which we used in the bare PCB manufacturing of Power Distribution Boards
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
New Equipment | Solder Materials
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien
Heavy copper PCB/ Power supply PCB Layer: 4 Material: FR4(Tg170) Finished copper thiness:4oz on each layer Min. trace width/spacing: 0.3/0.4mm(12/16mil) Application: Power controls, heat dissipation
Aluminum Bonded Copper or �ABC� represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC�s product technology. Critical m
New Equipment | Test Equipment
Measurement of copper thickness on printed circuit boards. Non-destructive, fast, accurate, and without influence from opposing copper layers. The SR-SCOPE®‚ coating thickness gauge measures the thickness of copper coatings on the top side of pc-bo
