New SMT Equipment: copper (Page 7 of 27)

KappZapp4 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper - NSF 61 Certified

KappZapp4 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper - NSF 61 Certified

New Equipment | Solder Materials

The KappZapp4 - 4% Silver formula is often preferred for hand soldering Stainless and Copper parts. It has a wider slushy or plastic range to allow users to manipulate parts during cooling. Low melting temperatures prevent loss of properties and mi

Kapp Alloy & Wire, Inc

Ceramic PCB

Ceramic PCB

New Equipment | Other

Layer count: Single-sided PCB Board thiness: 0.8MM Copper thiness: 1oz Dielectric constant(DK): 3.48 Surface treatment: Immersion gold

A-Tech Circuits Co.,Limited

Aluminium PCB

Aluminium PCB

New Equipment | Fabrication Services

Base Material: Aluminium Layer count: ten layer Board thickness: 3.0mm Copper Thickness:2 oz Surface finish: HASL Soldermask Colors: White

Shenzhen Aobo Technology Co.,Ltd

2 layers FR4

2 layers FR4

New Equipment | Components

FR4 1.5mm Pb Free HAL 1 oz copper

MARVEL INDUSTRY LIMITED

SN100c Lead-Free Bar Solder

SN100c Lead-Free Bar Solder

New Equipment | Solder Materials

FCT Assembly has partnered with Nihon Superior to be able to offer their patented lead free nickel stabilized tin/copper wave solder alloy- SN100C in North America. SN100C was developed to offer a technically superior and more economical option to th

FCT ASSEMBLY, INC.

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier

New Equipment | Fabrication Services

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications

Agile Circuit Co., Ltd

Laminates

Laminates

New Equipment |  

We can supply Copper Clad Laminates used in manufacture of Printed Circuit Boards meeting international standards from India. Laminate Types : CEM1, CEM3, FR1, FR2, FR3, FR4 and Flexible. Thickness : 0.2 mm - 6.0 mm Copper Cladding : 1

3Wi Technologies

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

High reliability Copper Clad Laminate

High reliability Copper Clad Laminate

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

MCPCBs for LED Thermal Management

MCPCBs for LED Thermal Management

New Equipment | Assembly Services

The MCPCB commonly consists of a metal core layer (typically aluminum or copper), a continuous dielectric layer and a copper circuit layer.  Protecting electronic components by removing heat, metal base boards feature a thermally conductive dielectri

Saturn Electronics Corporation


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Shenzhen Honreal for all your SMT Equipment needs

World's Best Reflow Oven Customizable for Unique Applications