New SMT Equipment: copper (Page 10 of 27)

AF-2

AF-2

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

GK-3

GK-3

New Equipment | Materials

Materials: FR-4 Copper Thickness: 2 oz Layer Count: 8 Layer, 2.4 mm Min. Hole Size: 16 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

XF-7

XF-7

New Equipment | Materials

Materials: FR-5 Copper Thickness: 1 oz Layer Count: 8 layer, 1.6 mm Min. Hole Size: 4 mil Min.Line Width/Space: 3 mil Finishing: Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

GK-4

GK-4

New Equipment | Materials

Materials: FR-4 Copper Thickness: 3 oz Layer Count: 6 Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 6 mil Finishing : Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

QC-1

QC-1

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold + Carbon ink

Zhuhai Camtech Circuit Co., Ltd

PHASCOPE® PMP10 for Measuring Coatings on PC Boards

PHASCOPE® PMP10 for Measuring Coatings on PC Boards

New Equipment | Test Equipment

The hand-held PHASCOPE® PMP10 is ideally suited for quality control in the electroplating and printed circuit board (PCB) industries. Because the instrument employs the phase-sensitive eddy current method (ISO 21 968), it allows the measurement of me

Fischer Technology, Inc.

8 Layer Mobile PCB

8 Layer Mobile PCB

New Equipment | Components

Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder

Headpcb

2 Layer CEM-3 pcb

2 Layer CEM-3 pcb

New Equipment | Components

Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F

Headpcb

2 Layer FPC

2 Layer FPC

New Equipment | Components

Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD

Headpcb

DUPONT™ - High Performance PCB Laminates (HPL)

DUPONT™ - High Performance PCB Laminates (HPL)

New Equipment | Materials

Pyralux® LF Copper-clad Laminate DuPont™ Pyralux® LF has been an industry standard in high reliability applications in the avionics industry for over 30 years and has a proven record of consistency and dependability and is ideal for aerospace and m

INSULECTRO


copper searches for Companies, Equipment, Machines, Suppliers & Information

Baja Bid Auction JUL 9-10, 2024

Easily dispense fine pitch components with ±25µm positioning accuracy.
Best SMT Reflow Oven

Stencil Printing 101 Training Course
Assembly Automation Technology

"Heller Korea"