New SMT Equipment: copper leached from under solder (Page 1 of 1)

SN100C - Lead-Free Solder Alloy

SN100C - Lead-Free Solder Alloy

New Equipment | Solder Materials

SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages

AIM Solder

SAC305 Lead-Free Solder Alloy

SAC305 Lead-Free Solder Alloy

New Equipment | Solder Materials

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t

AIM Solder

CYBERSOLV® C8508 - Spray Cleaner for Reflow Ovens

CYBERSOLV® C8508 - Spray Cleaner for Reflow Ovens

New Equipment | Cleaning Agents

CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. CYBERSOLV® C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lea

KYZEN Corporation

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

New Equipment | Cleaning Agents

AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. AQUANOX® A4651US will provide brilliant solder joints with no sump side additives and cleans exceptionally well on the late

KYZEN Corporation

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