Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat
Gore offers a family of composite organic dielectric materials for chip package substrates and printed circuit boards. Manufactured in high volumes and supplied in standard sheet sizes, each product offers electrical properties, processing advantages
Plastic anti static ic tubes and aluminum rails for shipping sensitive parts, and black conductive for storage and shipping of delicate semiconductors integrated circuits chips and other electronic devices. Anti-static, wafer packaging, plastic anti-
FACTS²™ DF2400™ C‑SAM® Automated In-line Inspection Tool for Defect-Free Production Without Sacrificing Throughput The FACTS²™ delivers state-of-the-art, automated in-line inspection for quality and process control. Delivering high throughput wit
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Laser Depaneling of Populated PCBs Low Cost Option for Depaneling Inexpensive Entry into UV Laser Processing The LPKF MicroLine 1120 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter
New Equipment | Board Handling - Storage
Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-2001 Model: Eureka SDC-2001 Fast Super Dryer Capacity: 1314 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% R
winsouce.jpg)
.gif)
