Our edge-hardened, pre-sharpened knife steel, which we refer to it as �Presharp,� is a high technology, lead-hardened steel that has revolutionized the die-making process. One of Austria�s oldest and most respected steel mills developed a unique proc
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cra
Plastic anti static ic tubes and aluminum rails for shipping sensitive parts, and black conductive for storage and shipping of delicate semiconductors integrated circuits chips and other electronic devices. Anti-static, wafer packaging, plastic anti-
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