New SMT Equipment: crack joint (Page 1 of 1)

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

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