Z-Communications PLL modules are designed for use in any variety of today�s commercial wireless applications. Current solutions are available from 100 MHz to 5.5 GHz and can be programmed to lock at specific frequencies through a 3-wire CMOS serial i
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
New Equipment | Rework & Repair Services
Our expert team is equipped to deal with the most sophisticated PCB assemblies, deploying leading-edge technologies such as the Air Vac DRS-24C BGA Rework Station to overcome the most complex process challenges. To give you a better idea of how we c
A.High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labora
A. High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labor
New Equipment | Rework & Repair Services
Our shortest turnaround-Time for BGA Rework / Reballing Services is within 24 Hrs. We are capable of reworking precision complex components such as shown below:(1) Any type of land grid array package and/or socket, including PBGA, CBGA, CCGA, High I/
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph; Hand build ;
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph ; Hand build ;
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
A turret modular mounting systems features both a high throughput and a high level of area productivity. High throughput of 48,000 cph with smallfootprint The mounter achieves an area productivity of 10,000 cph/m2 (under optimum operating co
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