Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
TW-Single-sided PCB 0028 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units pe
New Equipment | Assembly Services
TW-Multilayer PCB 0123 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
New Equipment | Assembly Services
TW-Aluminum PCB 0201 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
Verify and Optimize PCB Designs for Efficient Fabrication Today’s complex PCB designs require comprehensive verification before they are transferred to the PCB fabricator to ensure a successful and timely manufacture of bare boards. Problems arisin
New Equipment | Test Equipment
The new COMPACT Line collects the inheritance and success of the historic line of SEICA in-circuit and functional testers, designed meeting the requirements of the so called “lean production”, with a specific attention to the requirements of the prod
Introducing the BBP33 Label Printer - and a whle new way to make labels. No more tedious, time-consuming set-ups or calibrations. No more difficult to laod materials. No more wasted labels. No more hassles. This printer is so simple to use, most of o
New Equipment | Soldering Robots
Highly Flexible In Insertion Angles. Vertical inline soldering robot, UNIX-700FV is an ideal for irregularly shaped works into which is hard to insert the tip. The vertical multi-joint is utilized to freely change the head angle and quick operation.
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
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For OEMs, supporting the myriad of business processes involved in effective electronic component management from sourcing, purchasing, incoming inspection, kitting and device preparation plus inventory control and purchase ledger administration can d
