New SMT Equipment: cyberoptics se-500 (Page 1 of 1)

SE500-D™ Dual Lane 3D SPI

SE500-D™ Dual Lane 3D SPI

New Equipment | Inspection

80 cm²/sec with zero compromise on measurement accuracy and repeatability. With SE500-D™ you can maximize production utilization and transform your production process to achieve high quality solder joints through accurate volume measurement of solde

CyberOptics Corporation

SE500-X™ Fastest, Most Accurate 3D SPI (Large Board)

SE500-X™ Fastest, Most Accurate 3D SPI (Large Board)

New Equipment | Inspection

With SE500-X™ - 100% 3D solder paste inspection system, CyberOptics pushes inspection speed to the highest level possible. The SE500-X™ is capable of inspecting the most demanding assemblies with 80cm²/sec inspection speed without compromising on mea

CyberOptics Corporation

SE500ULTRA™ High-Speed 3D SPI

SE500ULTRA™ High-Speed 3D SPI

New Equipment | Inspection

World-Class Accuracy At Fastest Speed. The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor. An all-new, improved ultrafast sensor c

CyberOptics Corporation

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